X-ray test is a real-time non-destructive analysis to check the internal hardware components of the component. It mainly checks the lead frame of the chip, wafer size, gold wire bonding diagram, ESD damage and holes. Customers can provide good products for comparison. examine.
X-Ray inspection introduction:
This test is based on the original factory specifications and industry standards or specifications, designs feasibility test vectors or special test circuits, applies corresponding signal source input to the test samples, and analyzes specific conditions such as adjustment and control of peripheral circuits, signal amplification, or conversion matching. The logic relationship of the signal and the change state of the output waveform are used to detect the functional characteristics of the device.
Lead free test
Electron microscope plus EDS (Energy Dispersive Spectrometer), image acquisition and analysis processor, waveform acquisition and processing analyzer, through electron beam bombardment to detect sample pins, surface material analysis, through the periodic table of chemical elements to analyze whether the chip is a lead-free product.