X-ray (X-ray) detector uses low-energy X-rays without damaging the inspected item to quickly detect the inspected object. The high-voltage impact target is used to generate X-ray penetration to detect the internal structure quality of electronic components, semiconductor packaging products, and the welding quality of various types of solder joints of SMT.
X-Ray detection steps:
Confirm the test location and requirements of the sample type/material→Put the sample into the X-Ray fluoroscope inspection table for X-Ray fluoroscopy inspection→Picture judgment analysis→Mark the defect type and location.
Introduction to opening test
The decap test, also known as DECAP, is a destructive experiment. It uses chemical reagent methods or laser etching to remove the external package shell of the component to check the original logo, layout, process defects, etc. on the surface of the die. Testing is an auxiliary testing method.
Solderability test concept
In the process of assembling and soldering electronic products, poor selection of solderable ends or solder paste on circuit boards and components, and poor quality of flux will cause soldering problems, which directly affect the quality of the product. The main welding problems include poor wetting, bridging, cracks, etc., which will increase the workload of quality control and produce a lot of repairs, resulting in waste of manpower and financial resources, such as false welding, false welding and poor welding strength, which will directly lead to reliability. Sexual issues.
The product is divided into a single material and uniform material and then tested. Among them, lead, cadmium, mercury, hexavalent chromium, polybrominated biphenyls (PBB), polybrominated diphenyl ethers (PBDE) and other six hazardous substances meet the requirements of the RoHS directive, the highest Restriction standards: cadmium: 0.01% (100PPM); lead, mercury, hexavalent chromium, polybrominated biphenyls (PBB), polybrominated diphenyl ethers (PBDE) 0.01% (1000PM).